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smd ntc thermistor smd ntc thermistor with ni-barrier termination series/type: ordering code: b57620c5103*062 date: 2009-01-12 version: 3 ? epcos ag 2009. reproduction, publicati on and dissemination of this publicatio n, enclosures hereto and the information contained therein without epcos' pr ior express consent is prohibited content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! please fill in the table and then change the color to "white". this ensures that the table disappears (invisible) for the customer pdf. don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! identification/classification 1 (header 1 + top left header bar): smd ntc thermistor identification/classification 2 (header 2 + bottom left header bar): smd ntc thermistor with ni-barrier termination ordering code: (top right header bar) b57620c5103*062 series/type: (top right header bar) preliminary data (optional): (if necessary) department: sen ntc pd date: 2009-01-12 version: 3 prepared by: schwingenschuh martin release signed by: schwingenschuh martin release signed qs: gruber gerald modifications/remarks: customer, pn: filename: b57620c5103x062_3. specification no.: issue of specification: date of specification: date of confirmation of specification by epcos: ppap issue: flextronics ppap date: 12.01.2009 reliability extended reliability (more than standard)
smd ntc thermistor b57620c5103*062 smd ntc thermistor with ni-barrier termination sen ntc pd 2009-01-12 please read cautions and warnings and page 2 of 13 important notes at the end of this document . applications - temperature measurement and compensation for m obile phone applications (e.g. battery pack, tcxo, lcd display) and data systems features - standard eia chip size 0805 - smd ntc with ni - barrier termination (ag/ni/sn) - the component is compliant with rohs (d irective 2002/95/ec of the european parliament and the council of 27 january 2003 on the restricti on of the use of certain hazardous substances in electrical and electronic equipment) - suitable for lead-free soldering process electrical specifications part number zero-power resistance (at 25c) b 25/100 b 25/85 b 25/50 b57620c5103*062 10 k 3730 k 3% (3730 k) (3660 k) * = resistance tolerance: j for r/r 25 = 5% k for r/r 25 = 10% climatic category (iec 60068-1) 55/125/21 lower category temperature -55c higher category temperature 125c power rating at 25c p 25 210mw 1) dissipation factor (on pcb) g th approx. 3.5 mw/k 1) thermal cooling time constant (on pcb) t th approx. 10 s 1) heat capacity c th approx. 35 mj/k 1) weigth of component approx. 13 mg 1) depends on mounting situation part dimensions type l w t k 0805 2.0 0.20 1.25 0.15 1.30 max. 0.50 0.25 dimensions in mm termination ag/ni/sn dimensions in [mm] w l t k
smd ntc thermistor b57620c5103*062 smd ntc thermistor with ni-barrier termination sen ntc pd 2009-01-12 please read cautions and warnings and page 3 of 13 important notes at the end of this document . resistance - temperature characteristic r/t-curve 1011 / a01 r at 25c 10000 [ohm] b(25/100) 3730[k] 3 [%] rn at 25c 10000 [ohm] 5 [%] t [c] r_nom [] r_min [] r_max [] r/r25 [%] t [c] -55 700 137 568 416 831 857 18.8 2.7 -50 499 057 410 902 587 211 17.7 2.7 -45 360 153 300 493 419 813 16.6 2.6 -40 262 956 222 162 303 749 15.5 2.5 -35 194 112 165 954 222 269 14.5 2.4 -30 144 787 125 184 164 391 13.5 2.3 -25 109 030 95 279 122 782 12.6 2.3 -20 82 923 73 203 92 643 11.7 2.2 -15 63 591 56 682 70 500 10.9 2.1 -10 49 204 44 263 54 145 10.0 2.0 -5 38 279 34 738 41 819 9.2 1.9 0 30 029 27 481 32 577 8.5 1.8 5 23 773 21 931 25 615 7.7 1.7 10 18 959 17 625 20 293 7.0 1.6 15 15 207 14 241 16 173 6.4 1.5 20 12 280 11 581 12 979 5.7 1.4 25 10 000 9 500 10 500 5.0 1.2 30 8 178 7 714 8 642 5.7 1.4 35 6 734 6 312 7 156 6.3 1.6 40 5 575 5 193 5 956 6.8 1.8 45 4 636 4 292 4 979 7.4 2.0 50 3 874 3 566 4 182 8.0 2.2 55 3 237 2 962 3 511 8.5 2.5 60 2 720 2 475 2 965 9.0 2.7 65 2 304 2 085 2 523 9.5 2.9 70 1 960 1 765 2 156 10.0 3.1 75 1 674 1 499 1 848 10.4 3.3 80 1 434 1 278 1 590 10.9 3.6 85 1 235 1 095 1 375 11.3 3.8 90 1 067 941,3 1 192 11.8 4.1 95 927,3 814,3 1 040 12.2 4.3 100 809.0 707.1 910.9 12.6 4.6 105 706.2 614.4 797.9 13.0 4.8 110 618.3 535.6 701.0 13.4 5.1 115 542.8 468.2 617.5 13.8 5.4 120 477.9 410.4 545.4 14.1 5.6 125 422.5 361.3 483.6 14.5 5.9
smd ntc thermistor b57620c5103*062 smd ntc thermistor with ni-barrier termination sen ntc pd 2009-01-12 please read cautions and warnings and page 4 of 13 important notes at the end of this document . resistance - temperature characteristic r/t-curve 1011 / a01 r at 25c 10000 [ohm] b(25/100) 3730[k] 3 [%] rn at 25c 10000 [ohm] 10 [%] t [c] r_nom [] r_min [] r_max [] r/r25 [%] t [c] -55 700 137 533 410 866 864 23.8 3.5 -50 499 057 385 950 612 164 22.7 3.4 -45 360 153 282 485 437 820 21.6 3.4 -40 262 956 209 015 316 897 20.5 3.3 -35 194 112 156 249 231 975 19.5 3.3 -30 144 787 117 944 171 630 18.5 3.2 -25 109 030 89 828 128 233 17.6 3.2 -20 82 923 69 057 967 89 16.7 3.1 -15 63 591 53 502 73 680 15.9 3.0 -10 49 204 41 803 56 605 15.0 3.0 -5 38 279 32 824 43 733 14.2 2.9 0 30 029 25 980 34 079 13.5 2.8 5 23 773 20 742 26 804 12.7 2.8 10 18 959 16 677 21 241 12.0 2.7 15 15 207 13 480 16 933 11.4 2.6 20 12 280 10 967 13 593 10.7 2.5 25 10 000 9 000 11 000 10.0 2.4 30 8 178 7 305 9 050 10.7 2.7 35 6 734 5 975 7 493 11.3 2.9 40 5 575 4 914 6 235 11.8 3.2 45 4 636 4 060 5 211 12.4 3.4 50 3 874 3 372 4 376 13.0 3.6 55 3 237 2 800 3 673 13.5 3.9 60 2 720 2 339 3 101 14.0 4.2 65 2 304 1 970 2 638 14.5 4.4 70 1 960 1 667 2 254 15.0 4.7 75 1 674 1 415 1 932 15.4 5.0 80 1 434 1 206 1 662 15.9 5.2 85 1 235 1 033 1 436 16.3 5.5 90 1 067 888,0 1 246 16.8 5.8 95 927.3 768.0 1 087 17.2 6.1 100 809.0 666.7 951.4 17.6 6.4 105 706.2 579.1 833.2 18.0 6.7 110 618.3 504.6 731.9 18.4 7.0 115 542.8 441.0 644.6 18.8 7.3 120 477.9 386.6 569.3 19.1 7.6 125 422.5 340.2 504.8 19.5 7.9
smd ntc thermistor b57620c5103*062 smd ntc thermistor with ni-barrier termination sen ntc pd 2009-01-12 please read cautions and warnings and page 5 of 13 important notes at the end of this document . reliability tests of smd ntc thermistors are made according to iec 60068. the parts are mounted on standardized pcb in accordance with iec 60539-1. test standard test conditions r 25 / r 25 (typical) remarks storage in dry heat iec 60068-2-2 (=jis c 0021) storage at upper category temperature t: 125c t: 1000h < 3% storage in damp heat, steady state iec 60068-2-3 (=jis c 0022) temperature of air: 40c relative humidity of air: 93% duration: 21days < 3% no visible damage rapid temperature cycling iec 60068-2-14 (=jis c 0025) lower test temperature: -55c upper test temperature: 125c number of cycles: 10 < 3% endurance at p max - p max =210mw duration: 1000h < 5% solderability iec 60068-2-58 (=jis c 0054) solderability: 215c/3s 235c/2s resistance to soldering heat: 260c/10s 95% of termination wetted resistance drift after soldering - reflow soldering profile wave soldering profile < 5%
smd ntc thermistor b57620c5103*062 smd ntc thermistor with ni-barrier termination sen ntc pd 2009-01-12 please read cautions and warnings and page 6 of 13 important notes at the end of this document . mounting instructions 1. termination ni-barrier termination (ag/ni/sn) 2. recommended geometry of solder pads size a [mm] b [mm] c [mm] d [mm] 0805 1.3 1.2 1.0 3.4 3. requirements for solderability - wettability test in accordance with iec 60068-2-58 (= jis c 0054) : preconditioning: immersion into flux f-sw 32. evaluation criteria: wetting of soldering areas 95%. pb-containing solder: sn(60)pb(40) bath temperature (c): 215 3 dwell time (s): 3 0.3 pb-free solder: sn(95.1-96.0)ag(3.0-4.0)cu(0.5-0.9) bath temperature (c): 245 5 dwell time (s): 3 0.3 a a d c b b inner electrode base layer - silver diffusion barrier - nickel outer layer - tin
smd ntc thermistor b57620c5103*062 smd ntc thermistor with ni-barrier termination sen ntc pd 2009-01-12 please read cautions and warnings and page 7 of 13 important notes at the end of this document . - soldering heat resistance test in accordance with iec 60068-2-58 (= jis c 0054) : preconditioning: immersion into flux f-sw 32. evaluation criteria: leaching of side edges 1/3. solder: sn(60)pb(40), sn(95.1-96.0)ag(3.0-4.0)cu(0.5-0.9) bath temperature (c): 260 5 dwell time (s): 10 1 4. recommended soldering profiles reflow soldering profile: (according to cecc 00802) temperature characteristics at component terminals during reflow soldering (two cycles are permitted). wave soldering profile: temperature characteristics at component terminal s during wave soldering can be recommended once in general.
smd ntc thermistor b57620c5103*062 smd ntc thermistor with ni-barrier termination sen ntc pd 2009-01-12 please read cautions and warnings and page 8 of 13 important notes at the end of this document . 5. storage conditions solderability is guaranteed for 12 months from date of delivery for types with ni-barrier termination, provided that the components are stored in the original packages. storage temperature: -25 ... +45c relative humidity: < 75% annual average, < 95% on max. 30 days in a year, dew precipitation and wetness are inadmissible.
smd ntc thermistor b57620c5103*062 smd ntc thermistor with ni-barrier termination sen ntc pd 2009-01-12 please read cautions and warnings and page 9 of 13 important notes at the end of this document . taping and packing taping: tape and reel packing comply with specifications of iec 60286-3 blister tape dimensions and tolerances: definition symbol dimension (mm) tol. (mm) size 0805 compartment width x compartments length a 0 x b 0 1.6 x 2.4 0.2 compartment height k 0 1.4 max. overall thickness t 2 2.5 max. t 0.3 max. sprocket hole diameter d 0 1.5 +0.1/-0 compartment hole diameter d 1 1.0 min. sprocket hole pitch p 0 4.0 0.1 1) distance centre hole to centre compartment p 2 2.0 0.05 pitch of the component compartments p 1 4.0 0.1 tape width w 8.0 0.3 distance edge to centre of hole e 1.75 0.1 distance centre hole to centre compartment f 3.5 0.05 distance edge to centre compartment g 0.75 min. 1) 0.2 mm over 10 sprocket holes. part orientation in tape pocket p 1 1 d a a 0 a g f e w p d p 0 2 0 0 k t 2 b 0 section a-a direction of unreelin g equivalent terminations because of unipolar component
smd ntc thermistor b57620c5103*062 smd ntc thermistor with ni-barrier termination sen ntc pd 2009-01-12 please read cautions and warnings and page 10 of 13 important notes at the end of this document . reel packing: reel material: ps. tape material: blister tape break force: min. 10n top cover tape peel force: 0.1 - 0.65n at a peel speed of 300 mm/min, angle between top cover tape and the direction of feed during peel off: 165 -180. top cover tape strength: min. 10n length of tape: leader section: additional top cover tape, length min 400 mm, bef ore component section (including carrier tape with empty cavities, length min. 150 mm or min. 20 pcs. of empty cavities). trailer section: length min. 40 mm. empty part cavities at leader and trailer sect ion on tape are sealed with top cover tape. cavity play: each part rests in the cavity so that the angle between the part centreline and the cavity centreline is no more than 20. weight of loaded reel: max. 1500 g packing units: 3000pcs. package 8 mm tape definition symbol dim. (mm) tol. (mm) reel diameter a 180 -3/+0 reel width (inside) w 1 8.4 +1.5/-0 reel width (outside) w 2 14.4 max.
smd ntc thermistor b57620c5103*062 smd ntc thermistor with ni-barrier termination sen ntc pd 2009-01-12 please read cautions and warnings and page 11 of 13 important notes at the end of this document . cautions and warnings storage ? store thermistors only in original packagi ng. do not open the pa ckage before storage. ? storage conditions in original packaging: storag e temperature -25c ?+45c, relative humidity 75% annual mean, maximum 95%, dew precipitation is inadmissible. ? do not store smds where they are exposed to heat or direct sunlight. otherwise, the packing material may be deformed or smds may stick together, causing problems during mounting. ? avoid contamination of thermistor s surface during storage, handling and processing. ? avoid storage of thermistor in harmful env ironments like corrosive gases (sox, cl etc.) ? after opening the factory seals, such as polyvinyl-se aled packages, use the smds as soon as possible. ? solder thermistors after shipment from epcos within the time specified: smd with nickel barrier termination: 12 months smd with agpd termination: 6 months handling ? ntc thermistors must not be dropped. chip-offs must not be caused during handling of ntcs. ? components must not be touched with bare hands. gloves are recommended. ? avoid contamination of thermi stor surface during handling. soldering ? use resin-type flux or non-activated flux. ? insufficient preheating may cause ceramic cracks. ? rapid cooling by dipping in solvent is not recommended. ? complete removal of flux is recommended.
smd ntc thermistor b57620c5103*062 smd ntc thermistor with ni-barrier termination sen ntc pd 2009-01-12 please read cautions and warnings and page 12 of 13 important notes at the end of this document . mounting ? when ntc thermistors are encapsulated with sealing ma terial or over molded with plastic material, there must be no mechanical stress caused by thermal expans ion during the production process (curing / over molding process) and during later operation. the upper category temperature of the thermistor must not be exceeded. ensure that the materials used (sealing compound and plastic material) are chemically neutral. ? electrode must not be scratched before/during/after the mounting process. ? contacts and housing used for assembly with thermistor have to be clean before mounting. ? ensure that adjacent materials are designed for op eration at temperatures comparable to the surface temperature of the thermistor. be sure that surro unding parts and materials can withstand the temperature. ? avoid contamination of thermist or surface during processing. operation ? use thermistors only within the specified operating temperature range. ? environmental conditions must not harm the ther mistors. use thermistors only in normal atmospheric conditions. ? contact of ntc thermistors with any liquids and so lvents should be prevented. it must be ensured that no water enters the ntc thermistors (e.g. through plug terminals). for measurement purposes (checking the specified resistance vs. temperature), the component must not be immersed in water but in suitable liquids (e.g. galden). ? avoid dewing and condensation. ? be sure to provide an appropriate fail-safe f unction to prevent secondary product damage caused by malfunction (e.g. use vdr for limitation of overvoltage condition).
important notes page 13 of 13 the following applies to all products named in this publication: 1. some parts of this publication contain statements about the suitability of our products for certain areas of application . these statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. we nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. as a rule, epcos is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. for these reasons , it is always ultimately incumbent on the customer to check and decide whether an epcos product with the properties described in the product specification is suitable for use in a particular customer application. 2. we also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. in customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must theref ore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. the warnings, cautions and product-specific notes must be observed. 4. in order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous) . useful information on this will be found in our material data sheets on the internet (www.epcos.com/material). should you have any more detailed questions, please contact our sales offices. 5. we constantly strive to improve our products. consequently, the products described in this publication may change from time to time . the same is true of the corresponding product specifications. please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. we also reserve the right to discontinue production and delivery of products . consequently, we cannot guarantee that all products named in this publication will always be available. the aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. unless otherwise agreed in individual contracts, all orders are subject to the current version of the ?general terms of delivery for products and services in the electrical industry? published by the german electrical and electronics industry association (zvei) . 7. the trade names epcos, baoke, alu-x, cera diode, cssp, ctvs, dssp, miniblue, mkk, mlsc, motorcap, pcc, phasecap, phasemod, si ferrit, sifi, sikorel, silvercap, simdad, simid, sineformer, siov, sip5d, sip5k, thermofuse, windcap are trademarks registered or pending in europe and in other countries. further information will be found on the internet at www.epcos.com/trademarks.

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